The global Through Glass Via (TGV) Technology Market is poised for remarkable growth, driven by advancements in semiconductor packaging, consumer electronics, and the rising demand for miniaturized electronic components. According to a recent report by Dataintelo, the market is projected to grow at a CAGR of 18.5% from 2023 to 2030, reaching a valuation of USD 1.2 billion by the end of the forecast period.